Global Solder Paste Inspection (SPI) System Industry was valued at USD 231 Million in the year 2018. Global Solder Paste Inspection (SPI) System Industry is further estimated to grow at a CAGR of 4.5% from 2018 to 2025 to reach USD 331 Million. Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of SPI, you can reduce the defects related to soldering by a considerable amount.
Global Solder Paste Inspection (SPI) System Industry Share by 2025 (USD Million)
The global Solder Paste Inspection (SPI) System industry is segmented on the basis of type, application, and geography. Based on type, the industry is classified into 2D Automated Solder Paste Inspection, and 3D Automated Solder Paste Inspection. Based on product type, the industry is divided intoIn-line SPI System, Off-line SPI System, and others.
Based on End User, the Industry is classified in to Automotive Electronics, Consumer Electronics, Aerospace, Industrial Electronics, Semiconductor, Optoelectronics Industry, and Others. Based on region, it is analyzed across North America, Asia-Pacific, Europe, and LAMEA.
Major market players operating in the global Solder Paste Inspection (SPI) System industry include Koh Young, CyberOptics Corporation, Test Research, Inc (TRI), MirTec Ltd, PARMI Corp, Viscom AG, ViTrox, Vi TECHNOLOGY, Mek (Marantz Electronics), CKD Corporation, Pemtron, SAKI Corporation, Machine Vision Products (MVP), Caltex Scientific, ASC International, Sinic-Tek Vision Technology, Shenzhen JT Automation Equipment, Jet Technology, and other Company details are provided as per client requirements.
Solder Paste Inspection (SPI) System Industry Segmentation:
By Product Type
By End User Industry
Solder Paste Inspection (SPI) System Industry Overview, by Region